Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper
Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy
Electronics Forum | Mon Apr 23 10:11:11 EDT 2007 | grayman
Glue application is widely used in my country.However, some companies want to save cost and remove the glue application. We are also using fixture to cover some components. It has no problem. Please try cleaning your fixture by alcohol or water.Brush
Electronics Forum | Thu Dec 07 14:17:03 EST 2006 | russ
I would bet that it is a SMT adhesive used to ensure that the BGA does not move during a secoindary reflow prcess. this glue is easily removed with a soldering iron. Russ
Electronics Forum | Tue Jul 23 18:54:16 EDT 2002 | carln
Is anybody "successfully" cleaning adhesives from the DEK Pump Print stencils? Yes, Dave, I have searched the archives only to find comments ranging from easy to very difficult to clean. However, nobody states what process they are using. What ch
Electronics Forum | Mon Sep 21 18:37:10 EDT 2009 | sbayeta
Hi, Our SMT line has placement capacity of 80K cph, but only 21K cph gluing capacity. The rate between reflow and glue of our products is around 5 to 1. The line works great for the reflow boards, but when we produce glue boards the glue dispenser
Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Fri Oct 22 07:35:02 EDT 2004 | davef
Most glue suppliers recommend chemicals and methods for removing the product from stencils. What does yours suggest? Further, search the fine SMTnet Archives for background discussion.
Electronics Forum | Thu Dec 07 20:28:07 EST 2006 | davef
When rushing to get a job done, it's easy to accidently remove solder mask from a nearby via when dressing BGA pads after removing the part. Just hit the via with some super glue [then say a small prayer] and push on. As an alternative, look here:
Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ
Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing
Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach
| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec
