Electronics Forum | Wed Aug 11 16:09:50 EDT 2004 | Kris
Hi How does one distinquish between hard gold and immersion gold ? thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel what happens if the gold drops below 3" and the nickel is above 350" what are the typical failure modes associated with
Electronics Forum | Thu Aug 12 14:50:12 EDT 2004 | russ
This is interesting, I was once told by a PCB supplier that "soft gold" was immersion and the "hard gold" was the plated. But I agree with Dave F., Chris, what's going on? Russ
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Mon Aug 16 20:32:10 EDT 2004 | davef
First, we didn't say "electrolytic soft gold with a minimum thickness of 5-8 of Au". We said, "'electrolytic soft gold' thickness 5 to 8uin". FOCUS. ;-) Second, we're unaware of an industry accepted specification that you can reference. IPC-2221
Electronics Forum | Mon Aug 16 11:49:44 EDT 2004 | Kris
Hi Guys thanks for the replies. Dave, the spec is not for enig but for hard gold does your response alter if thats the case /
Electronics Forum | Mon Aug 16 18:09:33 EDT 2004 | Kris
ok I agree there has been a confusion with terminology When you say electrolytic soft gold with a minimum thickness of 5-8 of Au, is there a standard that you spec this from ?
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Mon Aug 16 16:26:19 EDT 2004 | Kris
what about areas that are soldered ? This is def not a Enig process and the specs are as they are not sure why thanks a lot for your help
