Electronics Forum | Tue Jun 28 09:39:00 EDT 2005 | davef
Points to consider are: * Gold plating too thick [SB LT 8 uinches]. [Obviously, we're talking about actual plating thickness, not the specification.] * Reflow recipe improper [SB 220*C 5-10 sec]. A recipe that works fine for HASL needs to be hotter
Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
Electronics Forum | Fri Feb 28 01:36:43 EST 2020 | crystal12
> What is the use of gold plated boards? <BR> <BR> With the increasing integration of IC, the more IC the more dense. The vertical tin spray process is difficult to flatten the pads, which brings difficulty to the SMT mounting, and
Electronics Forum | Tue Jun 28 10:51:32 EDT 2005 | mattkehoe
Thanks for the replies, - solder paste used ? NC ? other ? Water soluble 63/37 paste - reflow in Air or N2 ? Infrared - temp ramp up before soack (�C/second) ? Will have to check. This profile has been used on numerous gold plated boards in our
Electronics Forum | Fri Feb 28 10:07:29 EST 2020 | stephendo
Flatness is only half of the advantage. Gold doesn't corrode. There are other flat surfaces but do not last as long as gold.
Electronics Forum | Wed Jun 29 17:18:41 EDT 2005 | GS*
Very interesting tread, many thanks to all. Matt please, now what does it mean for you? Will your custmer accept dull solder joints or will the plating be changed ? (ie. HASL, ENIG, etc) Tnks and regards GS*
Electronics Forum | Tue Jun 28 09:13:46 EDT 2005 | russ
It appears that the reflow profile was incorrect or the paste was in bad shape on these boards from what I can see. I personally have never seen a board finish cause this symptom.
Electronics Forum | Tue Jun 28 10:41:57 EDT 2005 | GS
I am not an expert but just for my understanding: - solder paste used ? NC ? other ? - reflow in Air or N2 ? - temp ramp up before soack (�C/second) ? Tnks GS
Electronics Forum | Tue Jun 28 13:23:56 EDT 2005 | Bob Gilbert
Matt, Try a cooler profile by simply speeding up the conveyor by 10%. The difference may be the temperature the pads are reaching between the HASL boards and the Au boards. Are they the same thickness?
Electronics Forum | Tue Jun 28 17:38:13 EDT 2005 | mdang
We got the same problem. To solve it, we have to tint the pads first and do the normal reflow process. It works but take a lot of time to tint the pads. Any thoughts? Thanks, -Michael