Electronics Forum | Wed Apr 27 14:10:30 EDT 2005 | Bruno Lalonde
I m looking to implement a maintenance program here at Exfo, I'm looking form the norms on the hand soldering iron (tip to ground resistance and Voltage linking). Thank
Electronics Forum | Wed Apr 27 21:59:34 EDT 2005 | davef
Check with your soldering iron supplier. We'd expect them to say: * Tip to Ground Resistance:
Electronics Forum | Thu Apr 28 08:08:46 EDT 2005 | Bruno Lalonde
Thank for your quick answer, waht to you mean by yammering, I'm sorry my english is not very good
Electronics Forum | Thu Apr 28 09:11:34 EDT 2005 | davef
Don't apologize. Your English is fine. * In Enlish look here: http://www.freesearch.co.uk/dictionary/yammering * In French, maybe: Parler � tort et � travers
Electronics Forum | Mon Jan 26 04:13:48 EST 2004 | patthemack
First of all, did you profile this board with a mole, such as a KIC? Is the solder flowing, or just not wetting to the part or pad? I work with RF boards as well, but the main problem is tombstoning due to the ground plane side being larger because o
Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack
Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny
I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel
