Industry News | 2011-03-11 18:06:16.0
MIRTEC will feature an MV-7xi configured with the exclusive 15 Mega Pixel ISIS Vision System and proprietary 3D AOI technology in booth #1925 at the upcoming IPC APEX EXPO.
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
New Equipment | Assembly Services
Specification Model Item High -Speed Compact Modular Mounter RX-7R (P16SxP16S head) (P16Sxp8 head) (P8xP8 head) Board size Single lane conveyer
Fast Smart Modular Mounter RS-1R standard 150mm conveyor extensions, 250mm conveyor extensions, upstream and downstream upstream and downstream Board siz
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
