Electronics Forum | Tue Dec 14 08:01:14 EST 2004 | paul_fisher
Our paste is no new we have used it before [Cobar no-clean paste]. The solder joints look like they are bursting out salty looking crystals. Maybe the board cleaning is a red herring in that if the boards are clean it stops this crystalisation travel
Electronics Forum | Tue Feb 19 07:28:16 EST 2008 | davef
While you're waiting for others to reply, search the fine SMTnet Archives for postings like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=9328
Electronics Forum | Thu Feb 21 06:22:16 EST 2008 | gregoryyork
what is the solde finish on the bare board is it hasl? Are you using OA flux during assembly. A little more information would be good
Electronics Forum | Thu Feb 21 09:45:04 EST 2008 | ck_the_flip
Wow, I clicked on that link. Both myself and DaveF are in it. ..and this was from the '90s! Maybe it's time to look for another line of work. :-)
Electronics Forum | Tue Feb 19 12:41:20 EST 2008 | patrickbruneel
Yes dendrites can cause electrical shorts. The first stage of dendritic growth is a dark fern like pattern which reduce surface insulation between anode and cathode. In a more advanced stage the ferns transfer the plating metals of the conductors and
Electronics Forum | Tue Dec 14 10:26:48 EST 2004 | patrickbruneel
Yep that is a tough environment and no-clean will not work. The only two solutions you have is cleaning with a better cleanable paste (No-clean doesn't clean very well) Or you can go to no-residue and skip the cleaning. If you want to further discu
Electronics Forum | Tue Dec 11 17:04:33 EST 2007 | pgarsoe
We want to start a discussion on the solar manufacturing market in response to a conversation with Anita Brown of Indium at the recent Productronica show in Germany. Since we referred to it in our show report newsletter we decided to start a thread a
Electronics Forum | Fri Feb 01 14:23:47 EST 2002 | delnosa
Looking for help on getting information on understanding the physics of micro-fracture growth rate within the BGA ball (or solder joints in general). Hoping to find a fairly straight forward study on the concept/theory of this topic. I'm not a meta
Electronics Forum | Sat Feb 02 09:33:33 EST 2002 | davef
�8.4.2, Cracking Of Soldered Joints in the epic "Soldering In Electronics" by RJ Klein Wassink [Electrochemical Publications,ISBN 0 901150 24 X] covers cracking differented by: * Overloading * Creep * Fatigue You can't go wrong by starting there.
Electronics Forum | Tue Mar 26 06:07:58 EDT 2019 | pooja_4t
Hi i am referring Tin whisker report JESD201A class 2 standard from Vishay. i can see at TC -55/85C using pbfree reflow there are 0 growth at 500&1000 cycles. for snpb reflow and the same temperature and same cycle significant growth can be found. my