Electronics Forum | Tue Jun 02 17:45:46 EDT 2009 | boardhouse
Hi Nicoleta, As a board shop, either are good choices but in my experience with my customers ENIG has alway been the favorite due to it is easier to work with in regards to not having to tweak your equipment. As long as the board shop that you are u
Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris
Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b
Electronics Forum | Mon May 11 18:30:10 EDT 2009 | boardhouse
Hi Milas, Here is a link to an artical on the subject. http://pcdandf.com/cms/content/view/4784/95/ The big difference in the to is that ENIG is self limiting where as electroplating is not. All product manufactured with either finish goes throug
Electronics Forum | Sat Mar 25 07:10:12 EST 2006 | davef
We agree with Chris. If your gold is applied properly and is the correct thickness, you will see no difference. One nit on Chris' comments: immersion gold will plate-out [self-limit] around 8 thou, although we've heard 12 thou.
Electronics Forum | Mon Mar 27 09:54:35 EST 2006 | russ
Flash gold is usually to thick and will cause embrittlement of your solder joints if concentration exceeds I beleive 6% in the joint
Electronics Forum | Thu Apr 20 13:42:23 EDT 2006 | fredericksr
I've seen embrittlement %s down to 3%, but a standard 5 mil solder pad would require well over 100uIn of plated gold to cause embrittlement. -Other Russ
Electronics Forum | Wed Jun 03 01:59:41 EDT 2009 | nibirta
Thank you all for these helpfull informations. I knew that I always can have the right support from you :) Tks again. Nico
Electronics Forum | Wed Jun 03 11:04:32 EDT 2009 | joeherz
Another thing to consider - If you're processing lead free, the nickel layer between the copper and gold provides extra protection against copper dissolution. This is a nice piece of insurance especially when performing rework. Cheers
Electronics Forum | Sat Jun 06 15:16:17 EDT 2009 | jameskelch
Here is a link to a recent industry article that may be of service: http://www.pcb007.com/pages/zone.cgi?a=49717
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The