Electronics Forum | Fri Dec 22 10:03:54 EST 2006 | realchunks
solder paste [ top side ] Actually it's kinda the norm in most places. Subjects your active components to one less heat cycle.
Electronics Forum | Fri Jan 19 14:29:19 EST 2007 | I.P. Freely
What is the part designator? A lot has to do with that. Also, is this a double sided reflow board. Perhaps you need to change your process to accept two heat cycles simultaneously. Solder thieves should work. Check the archives.
Electronics Forum | Fri Apr 20 07:40:28 EDT 2007 | realchunks
Hi PeteB Do you know PeteC? Anyway, it all depends on your most sensitive part. Look up the spec sheets to determine. Most general parts can take 3 or 4 heat cycles easily.
Electronics Forum | Mon Mar 21 12:43:20 EDT 2011 | hegemon
Passives first reflow, and BGAs second side reflow. Uses only one heating cycle for your BGAs, and the passives will stay in place just fine given correct profile parameters. There are a few exceptions, but this is generally how it is done. My $.02
Electronics Forum | Mon May 16 21:16:50 EDT 2022 | SMTA-64387687
Can you brush some flux on the connector pins and run them through a heat cycle, hot enough to activate the flux, but not enough for solder to melt or component damage? That should remove most of the oxidation. Then, you can run it through your regul
Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef
We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin
Electronics Forum | Thu Mar 01 22:21:06 EST 2007 | davef
From our notes ... An intense evaluation was completed in 1992 that involved testing of three board types [6 layer FR4, 6 layer ceramic copper thick film, and a 4 layer copper-invar-copper board] by the Navy Surface Warfare Center, Crane, IN. [Obvio
Electronics Forum | Thu Aug 30 19:58:24 EDT 2012 | warwolf
What is the actual function of the shortwave IR in the wave machine process? Is it just another heat source?. i know it can apply a lot of heat in quick cycles and has ‘penetrating heat’ but is that it? seems a bit too simple.
Electronics Forum | Thu Jun 16 17:31:14 EDT 2005 | Doug
Chris, From your email I am assuming you are using an immersion tin process. Is that correct? If so, I would highly recommend you talk to your board house about the amount of tin that is being deposited on your boards. If the tin deposit becomes ver
Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax
Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side
