Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Mon Dec 27 11:15:17 EST 1999 | g cronin
please send me a copy of sample reflow profiles for BGA packages. Please indicate the type of BGA and the Oven used. As well as any special characteristics of the assembly that have effected the profile. I a trying to learn more about the common "t
Electronics Forum | Wed Jun 06 20:25:06 EDT 2001 | davef
Good machine, good people; yer just about there. Look here for help: http://www.mot.com/SPS/PowerPC/teksupport/teklibrary/papers/BGA_AssemblyRework.pdf http://channel.intel.com/design/quality/component/rework_socketprofiles.htm Earl Moon, a depart
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman
| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und
Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Wed Jun 06 13:38:15 EDT 2001 | Michael Parker
To expand on Wolfgangs reply, I suggest you contact your local SRT rep. We recently had the same type of problem as yourself. This is the path we followed. Arrange for operator training, for yourself first, then the operators after you get the machi
Electronics Forum | Tue Dec 28 12:55:16 EST 1999 | Justin Medernach
Greg, The best advice that I can give you is a PBGA will respond just like any other surface mount package. There may be a 5 degree delta between a PBGA 356 and a QFP208 but the two respond very similarly in the convection reflow environment. CBGAs
Electronics Forum | Fri Dec 02 01:49:48 EST 2016 | jeya7376
I want to do improvement in conversion time. We running small quantity board and frequently do conversion. we produce very simple board no BGA only resistor, capacitor, LED, IC and transistor. We are running same model top and bottom in 1 reflow oven
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
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