Electronics Forum: ideal and humidity and relative (Page 2 of 2)

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech

Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt

Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Aug 18 15:04:25 EDT 2014 | rgduval

Off hand, I can't recall a "formula" for how long boards could sit in a specific RH environment. I've done a couple of quick Google searches, and can find a bunch of information on the dispersion rate of moisture in various PCB materials, but, nothi

Implementing Standards and Requirements within a CM - When is too much?

Electronics Forum | Thu Jun 01 22:05:01 EDT 2023 | calebcsmt

For contract manufacturers, Unless expectations/requirements are particularly specified by customers OR there is a discussion and contract in place, what are the expectations when it comes to the assembly standards and practices? Is J-STD essenti

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