Electronics Forum: import and my12 (Page 2 of 15)

Inspection and splicing

Electronics Forum | Fri Jan 25 05:22:47 EST 2008 | dekiper

Hi, You could try other types without brass shim. It's also important to use a good tool that is adjusted properly. Contact me and I will help you with quality samples and instructions. http://www.dekitools.com // Per Gester

Solder Balls and Humidity

Electronics Forum | Fri Aug 24 09:29:08 EDT 2007 | jgrootkoerkamp

Solder balls with wave soldering can have different causes. The two most important are the solderresist and the flux. I have similar problems, after changes the flux type 90% off all solderballs are gone. KR, Joris Groot koerkamp

Td and Tg

Electronics Forum | Wed Aug 27 13:08:30 EDT 2008 | vladig

Td - is the degradation temperature for a laminate (board), while Tg - is glass transition one. There is one more (even more important) - delta Tg. They characterize the quality of the laminate material. Regards, Vlad www.sentec.ca

No Clean and Underfill

Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo

No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux

warp and twist

Electronics Forum | Tue Feb 14 22:20:10 EST 2017 | swestheimer

Hi Dave, Thank you for your inputs as they were good suggestions. I however let out one important detail and that this is IMS material and not glass reinforced so I think that there is more bending going on during processing than warping and twistin

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I

Circuit cam and mydata

Electronics Forum | Fri Mar 27 12:46:23 EDT 2020 | unisoft

Unisoft has been import gerber only for years to setup assembly, aoi machines, etc. *** Help for Importing GERBER only files for used in programming Assembly, AOI, Test, Selective Soldering machines (X/Y Center, Rot, Part#). Also allows you to cre

Cp and Cpk values

Electronics Forum | Tue Mar 04 15:46:00 EST 2003 | EW

I'm not sure to what degree you are manually crunching this data.....If you can set up the data manually, or parse the data from a recording function, to allow it to import into a database with a formula for Cpk, and everything else you could ever in

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

Flexi boards and uBGA

Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG

Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w


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