Electronics Forum | Thu Nov 18 12:00:00 EST 2004 | Shean Dalton
Have you considered mounting this component after the assembly has been washed. Then, mounting the component and cleaning its solder joints individually. Alternatively, have you considered using alternative cleaning solutions to a saponifier (and a
Electronics Forum | Wed Jan 14 13:58:07 EST 2009 | swag
We use Loctite 3609 - it's good stuff.
Electronics Forum | Wed Jan 14 17:21:04 EST 2009 | davef
We love Loctite 3609 as a chip bonder, but would never consider it to secure large components
Electronics Forum | Wed Aug 01 02:17:00 EDT 2001 | djarvis
Anyone placing micro,mini,midi spring inductors (as can be seen on http://www.coilcraft.com) with an FV7100? I can get the little suckers to "test" all day long, but soon as I go into production mode the vision system rejects around 20%. I've tried c
Electronics Forum | Wed Jan 14 16:52:40 EST 2009 | vleasher
We currently use Epibond 7275 and it cures way too quickly to allow the component to settle down on the board. Have you used the Loctite 3609 in the application i'm speaking of with success?
Electronics Forum | Wed Jan 14 21:42:35 EST 2009 | davef
We view both Epibond 7275 and Loctite 3609 to be very similar. They're competing chip bonders.
Electronics Forum | Wed Jan 14 17:31:24 EST 2009 | swag
Doesn't sound like we use it exactly like your application. Similar to what davef says we use it for smaller to medium size or dense parts (sigle dot under the center of the part) that have potential to fall off on 2nd side processing. I can say it
Electronics Forum | Thu Jan 15 12:32:08 EST 2009 | vleasher
After doing some more research it looks like Loctite made a material called Cornerbond 3515 that seems as if it has the characteristics we are looking for such as curing after the solder is liquidous. But it appears that it isn't manufactured anymore
Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher
I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe
Electronics Forum | Wed Jan 14 17:07:46 EST 2009 | davef
In BIG-boy, high vibration applications to secure large components, we've used 3M #2214 structural adhesive [One part, 250*F (121*C) curing 100% solids, paste consistency epoxy adhesives designed for bonding metals and many high temperature plastics
