Electronics Forum | Thu Mar 15 17:19:12 EST 2001 | mparker
Are the tin/lead ratios compatible betweem HASL and wave solder? Probably are, just a remote possibility. Flux application is? bubbler, sprayer? Either way, are you getting good misting, coverage on those teeny 0.5mm test points? If not, then no
Electronics Forum | Tue Sep 06 10:20:33 EDT 2005 | slthomas
I love these stories. At my previous employer we experienced intermittent failures on an audio microprocessor assembly being used on a *new* product. This board had numerous microprocessors and complex firmware aboard. They discovered one PLCC on
Electronics Forum | Tue Sep 01 15:18:04 EDT 2009 | babe7362000
Is there anyone out there that can help me with a Y1 axis failure on a Meridian 1030? It seems to be an intermittant problem but is now getting worse. Please let me know if you can help
Electronics Forum | Wed Jan 05 09:24:53 EST 2005 | cyber_wolf
Well...here is what I can tell you: I have over $40K worth of bent A12,A13,A14 tools.Yes you heard me right $40K worth. (Since 1995) Mydata used to make a repair kit to fix them but decided to quit. They tell me the reason they quit making the kit i
Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala
Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu
Electronics Forum | Thu Nov 15 15:27:50 EST 2012 | davef
Finally, help for those searching for compatibility A new standard and guideline will make it much simpler for users to determine whether they’ve got the right chemistry to ensure compatibility. April 23, 2012 By Terry Costlow, IPC online edit
Electronics Forum | Thu Jul 28 22:35:58 EDT 2011 | davef
The consequences of poor heel formation in solder connections include: * Lower solder joint strength * Possible intermittent short circuits * Reduced first-pass yields * Increased inspection cost * Increased rework cost * Likely field failures * Like
Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob
Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion
Electronics Forum | Wed Dec 07 13:10:32 EST 2011 | conjugate
Hi Reese, the contamination is coming from the material of the PCB itself. Basically, there`re failure observed in the products from electronics factory. preliminary analysis been done, the main board not properly functioning due to bad solder. next
Electronics Forum | Tue Jul 15 18:44:20 EDT 2003 | davef
Sam says, �The only question remaining to me is that why the failure happened after 48 hours instead of immediate failure after soldering.� Let�s recap: * Had good-looking solder flow. * Passed the initial electrical test. * Failed the later electri
