Electronics Forum | Wed Oct 29 20:28:59 EST 2003 | davef
The possibilities are dizzying, aren't they? In our dingy fog, if we don't understand your requirement, say so. 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IP
Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef
IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285
Electronics Forum | Fri Aug 08 12:52:57 EDT 2003 | davef
So, if you give your customers design guidelines and one their products causes a cataclysmic explosion, resulting in the deaths and disfigurement of many handicaped third-world children, could a lawyer consider you responsible? Spec Fir Tree General
Electronics Forum | Wed Nov 07 20:01:35 EST 2007 | davef
Josh: Hole size to lead diameter ratio is meaningless. Minimum and maximum component lead to finished hole size clearance do not vary according to component lead diameter or hole size. Regardless, here's what you want to smack those goofballs over i
Electronics Forum | Wed Apr 18 08:57:45 EDT 2018 | davef
Here is the IPC Standards Tree [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/SpecTree.pdf ]. The design standards that you ask about are over on the right side. I'd guess that the following standards would be a good starting point: * IPC-2221, "
Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef
IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn
Electronics Forum | Sat Dec 01 09:12:27 EST 2001 | davef
Ah, there�s the rub. So often we see scoring requirements defined based on depth of cut. This ignores that the depth changes with a variety of factors, including: * Wear on the cutting blade. * Variation in thickness of the fabricated board. So, c
Electronics Forum | Mon Jul 10 20:59:14 EDT 2006 | davef
Dave Try: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards Our old [euphemistically] friend Earl Moon has written extensively on DFM. Look at his site: http://
Electronics Forum | Fri Nov 09 07:40:07 EST 2007 | jdumont
Thanks for all the great suggestions guys. We do not have topside heating but topside temps are where they should be before hitting the wave. No excessive copper in the area either. We are going to start with the most problematic board and use it as
Electronics Forum | Tue Sep 18 07:52:29 EDT 2007 | davef
Does the change from supplier to supplier as a result of: * Board definition? * Differences in processing at fabs? 3 Specification Fir Tree General Technical Specification 3a Design/Layout: * IPC-2221 * IPC-2222 3b PCB Fab: * IPC-6011 * IPC-6012 * I
