Electronics Forum: ipc-a-610 and fill (Page 2 of 9)

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 18:10:54 EDT 2013 | davef

I agree with Rob. These solder connections are unacceptable. BR, davef

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 18:40:48 EDT 2013 | rway

I also agree. Even if it did meet specs, I wouldn't let a joint like this out. Reese

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:37:39 EST 2006 | GS

Have you seen IPC-A-610 D ? regards GS

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Touch-up and inspection of visual defects

Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge

I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1

Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval

We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo

CSP and underfill

Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi

weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??

Wave Solder issues

Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist

Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.

SAC305 and Selective Soldering

Electronics Forum | Wed Sep 18 14:12:40 EDT 2013 | pjchonis

Hello Bachman. SAC305 is the most common lead-free solder alloy, not only for wave soldering but also selective. Most of our selective customers (especially automotive) are using SAC305. What is more important than the alloy to consider is the flux


ipc-a-610 and fill searches for Companies, Equipment, Machines, Suppliers & Information