Electronics Forum | Sat Dec 01 13:43:51 EST 2012 | anvil1021
Do you mean the Paste Layer of the Gerber files? If so then you can check for aspect and area ratio of the component apertures (which is determined by the thickness of the stencil) there is an IPC specification for this and it is IPC-7525A I believ
Electronics Forum | Sat Aug 22 16:16:13 EDT 2015 | davef
Comments are: * Read “Challenges for Step Stencil Printing” [Carmina Lantzsch, Georg Kleemann, LaserJob GmbH] http://www.smtnet.com/library/index.cfm?fuseaction=view_article&article_id=2096 * I want to say that IPC7525B [Oct 2011] improved the dis
Electronics Forum | Fri Feb 16 01:59:18 EST 2018 | ameenullakhan
Hi Dave, Thank you. I have been through IPC 7525A. But our boards bit more complicated and quality requirements are very stringent. 7525A doesn't help for much extent. Any other you have gone through and found to be very good to understand and lear
Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef
Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t
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