Electronics Forum: j-std-001c (Page 2 of 4)

Re: Question on J-STD-001B

Electronics Forum | Tue Mar 21 20:27:26 EST 2000 | Dave F

Sorry, I went dyslectic of the doc numbers, but you get what I mean (I hope): * J-STD-001B was released October 1996 * J-STD-033A was released April 1999 Without belaboring the point further, J-STD-001C is current and contains references to J-STD-

Repair of FR4 double-sided pcb

Electronics Forum | Thu Aug 22 07:48:30 EDT 2002 | Dave Milk

While separating individual pcbs from a panel, operators have caused delamination of the edge of the board, at the tabs that were cut. How can these boards be repaired? The delamination causes them to fail J-STD-001C 9.2.1.1.d. Also, what would yo

No-clean paste flux v.s RMA solder

Electronics Forum | Wed Mar 12 10:25:29 EST 2003 | davef

J-STD-001C, 7.2.1 Flux Application says words to the effect of: When an external flux is used in conjunction with flux cored solders, the fluxes shall be compatible. Regardless of whether these are or not flux cored solders, this begs the question:

PCB Au thickness

Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef

J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin

Problem with conformal coating

Electronics Forum | Wed Feb 23 22:38:28 EST 2005 | davef

We: * Cure 1B73 according to spec in a heat box, like a Blue-M * Clean nozzles [one set in use, one set being cleaned] in thinner in a bronson ultrasonic cleaner * Haven't evaluated coatings in years, but would do it according to J-STD-001C, Reqmnts

solder balls

Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef

Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

Ionograph or Omegameter

Electronics Forum | Sat Nov 06 06:22:53 EST 2004 | GS

Many Thanks Davef for your continuos great tech support. From my side, I am still fighting against BIC coming with sockets ( still tons of Br-). Even the supllier is surprised about this pbm. But as we know no Standards available to control bulk ion

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i

Manufacturing and test room cleanliness

Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas

J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni


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