Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Mon Dec 17 02:08:21 EST 2007 | mun4o
Hi, I have a lot of solder bridge in our wave soldering process.We use SACX0307 and Surf 11 flux.the SW mashine is Vitronics delta 6622.Itry to change flux and termoprofile but results is not god.Can you halp me - recommend me some flux or other adv
Electronics Forum | Wed Jul 05 13:30:37 EDT 2006 | Chris Griffin
Likely causes of this are: -Preheat temp. too low -too much dross -uncured epoxy -PCB contamination ...also varify the solder flow over the wave is smooth.
Electronics Forum | Thu Jul 06 04:41:58 EDT 2006 | Rob
MF300S is quite an old flux, & a lot has happened since then on the flow solder front - are you sure it's designed for Lead free, or is it just a traditional flux that SHOULD work OK with Lead free?
Electronics Forum | Mon Dec 17 15:11:35 EST 2007 | chef
Blew chunks - thanx for thinking outside the box. Of course there's two sides to every story. Just last week I had a new operator "splash" a couple of boards. Top solder was great, it was all one big solder bridge. Come to find out, the operator forg
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Mon Dec 17 15:41:15 EST 2007 | shrek
Ha-ha-ha-ha-ha,me lad. Wave solder is like an onion, it's got many many layers. Kind of like me-self. I'm a big ogre with many complex layers. At any rate i like the other colleague with his adverstising trigger finger. by golly, me chap, he's a
Electronics Forum | Wed Jul 05 10:13:02 EDT 2006 | jdengler
Is the flux rated for lead free? These higher temps will cause most lead rated fluxes to burn off prior to the wave. Jerry
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