Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef
RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet
Electronics Forum | Thu Jul 14 10:29:53 EDT 2005 | stepheniii
It can be used as a sales tool. Choose a CPK you want, then "adjust" your definitions and limits untill you achieve that. Just be prepared to explain that someone who is unavailable for explainations set up the SPC system, and you are just following
Electronics Forum | Wed Jul 19 07:27:09 EDT 2023 | roachindignant
This problem appears whenever I turn on my UP2000 HiE printer and try to perform the initial Reset. Hardware Limit Warning (E00938:10) All sensors on the Input/Output Screen are functioning appropriately and will give expected results when checked
Electronics Forum | Fri Jul 15 12:41:56 EDT 2005 | russ
You are not wrong in monitoring the Product (your really not monitoring the process). This methodology is valuable if your process is unstable (SPC is used to stabilize process). There is value in "real time" inspection of a process's product as lon
Electronics Forum | Mon Jul 18 18:36:01 EDT 2005 | slthomas
"thomas, why isn't it process control," Minute detail, really. Defects aren't a measurement of process parameters, they're the result of them (and a few other things that have been mentioned). SPC measures process parameters. It is preemptive, and
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
Electronics Forum | Wed Aug 06 11:16:20 EDT 2014 | clayton
While I have had very limited experience with mancorp, the experience I have had, has been less than satisfactory. However I do have a great deal of experience with Essemtec. I currently own two complete turnkey smt lines from Essemtec and couldn't
Electronics Forum | Sat Feb 06 16:42:18 EST 2021 | sg7914
Respected all; I am currently a student at RIT and working towards my master's in Manufacturing and Mechanical System Integration with a specialization in Electronics Manufacturing. I came across an interesting topic regarding the tooling and fixt
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