Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Tue Jul 24 07:37:35 EDT 2018 | fugtussey
PACE Worldwide has a new BGA Rework Station slated for production next month called the TF 2800. . It is based on the PACE's popular TF 1800 BGA & SMT Rework System (see TF1800 at http://www.paceworldwide.com/products/area-array-bga-rework/bga-rework
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Fri Jul 14 16:32:55 EDT 2023 | calebcsmt
Does class 2 vs class 3 PCBs effect variance/tolerance in terms of actual positioning of pads/traces? For example, if fiducial is to be at 10mm. What's the tolerance for class 2 vs class 3? [variance allowed] Does panelization have any effect on t
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
Electronics Forum | Wed Oct 03 12:02:04 EDT 2001 | kjwaskow
We are getting solder blobs forming in open areas of the BGA, between the center array and outer array. THe ceter array balls are starved of solder, so they are presumably the source. The theory we hold is possible moisture causing the solder to mo
Electronics Forum | Tue Dec 23 07:49:10 EST 2014 | robertwillis
the most common reason can be popcorning of the device or warpage of the packages during reflow. the distacnce from the boatom of the device is decreased hence the solder shorts. Trying doing some measurements on the package during simulated reflow.
Electronics Forum | Mon Jul 25 19:12:17 EDT 2022 | proceng1
I generally do not design an array larger than 10" x 12". Other than just thermal mass, the one issue to watch with extra length is if the array is so large that it spans multiple heat zones at the same time. We have panels that are up to 48" l
Electronics Forum | Fri May 14 14:13:54 EDT 2004 | bwet
Does anyone know of a technique t selectively remove solder mask outside of the traditional scraping or grinding methods. (This would be in areas around an area array part.) BWET
