New Equipment | Soldering Robots
C-Prime Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm. The Nordson DIMA Desktop Series is a product range for ACF
New Equipment | Soldering Robots
C-Slide Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with a fixture size up to 250 x 250 mm. The Nordson DIMA Desk
New Equipment | Soldering Robots
C-Turn Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm. The Nordson DIMA Desktop Series is a p
Industry Directory | Manufacturer
SilmanTech is a One-stop solution supplier of SMT Assembly equipment in China. We offer BGA rework station, Glue dispensing robot, PCB loader/unloader, (AOI) machine, x-ray inspection SMT parts and accessories.Inbox us for more..
Two-component polyurethane (PU) glue laminating machine The two-component polyurethane (PU) glue spraying machine is mainly used to evenly and quickly spray the two-component polyurethane A and B glue mixture on the bonding surface of larger-format b
C-Tack Desktop System for ACF Laminating, also called Pre-Tacking or Pre-Bonding. The C-Tack Desktop System was developed by Nordson DIMA for ACF Laminating (Pre-Tacking) applications. It uses pneumatic bonding head technology and offers reliable p
New Equipment | Soldering Robots
Constant-heated Bonding Machine Model No.: CHB312 Features: 1)Panasonic temperature controller ensures high accuracy heating control. 2)Omron dial knob timer enables easy operation and repeatability. 3)User can setup temperature, time and pres
Two component (also called meter mix) dispensing systems are used for mixing and dispensing two part materials, typically adhesives. The two parts of the adhesive come together in the system, typically through a static mixer, and activate to start th
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New Equipment | Cleaning Equipment
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry. Apllication: ．Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging,
