Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco
Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how
Electronics Forum | Tue Jul 18 07:50:47 EDT 2006 | adlsmt
Are the leads actually pulling off the pads or are the pads coming up as well? Did you ever try this "experiment" before you used lead-free?
Electronics Forum | Fri Sep 02 06:47:17 EDT 2005 | dougs
Is there a standard that we should aim for in respect to the strenght of the solder on SMT leads? We have a customer who are testing our product by pulling leads off of pads then returning them.
Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Electronics Forum | Tue Oct 14 09:26:15 EDT 2008 | bickt
Hi, I have been at both ends of this business. I installed lines and have been in manufacturing for some 25 years. Do not go by the test boards that the installer or OEM uses. these boards are too broad and loose for any kind of guide line to est
Electronics Forum | Thu Aug 16 13:57:30 EDT 2001 | Hussman
Ouch! I thought that went away 12 years ago! Visual inspection to IPC standards should be used. Pulling and pushing leads is not even close to being consistent. I bet your customers or ISO auditors have never seen this practice. If they must pul
Electronics Forum | Fri Jun 25 11:29:43 EDT 2004 | tcp
We have had some field returns of a double sided SMT board manufactured in the February timeframe. The boards are encapsulated in an epoxy potting. When removing the potting some SSOP devices came off in the potting. The leads had pulled out of th
Electronics Forum | Wed Sep 22 22:27:23 EDT 2004 | pdeuel
Just a thought, Solder flows to leads of parts and will tend to flow to hotest point. Im not shure but top side temprature might be hotter than bottom side. wouldent this cause solder to pull further up lead after leaving wave.
Electronics Forum | Sat Oct 28 10:24:56 EDT 2000 | Ben
Try to insert thin copper plate (approx. 1.5mm thk) at the end of the flow direction. Place it approx. 2mm away from the lead. The copper will pull away the solder & thus minimise bridging problem.
Electronics Forum | Fri Jun 25 13:25:04 EDT 2004 | russ
Sounds like the wrong reflow profile was possibly used on this batch, Or you have a lead solderability problem. Usually you will pull a pad off of the board instead of the lead out of the solder joint. When a lead is torn from the joint it will ha
