Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika
Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane
Electronics Forum | Tue Sep 02 12:49:07 EDT 2008 | markhoch
Out for reballing??? The LGA's that I'm familiar with do not have balls. Pull them off with a BGA rework station. Clean up the part and PCB by carefully removing extraneous solder, paste the PCB, (or the bottomside of the LGA itself) and replace. Ref
Electronics Forum | Thu Sep 02 06:22:34 EDT 2010 | sachu_70
Good. This is the right way to profile. Let me ask you, have you anytime soldered QFN componets on your boards? The concept of LGA soldering is similar to that used for a QFN package. QFN soldering also exhibits void formations, and is an inherent pr
Electronics Forum | Tue Oct 06 13:46:35 EDT 2015 | deanm
Agree. However the LGA has an even lower standoff, so I would think it would be an even greater challenge. The LGA is a cheaper choice but want to know from those who have done both if the extra cost of the SnPb BGA would pay for itself in lower rew
Electronics Forum | Tue Apr 01 09:36:25 EST 2003 | davef
You're correct. There is no way you can aquous clean under a low stand-off part like a LGA. Your approach seems reasonable, given your constraints. [As long as your customer is paying, what the hey!!! Give 'em what they want.] Consider joining t
Electronics Forum | Fri Sep 03 06:53:38 EDT 2010 | arjan
Yes, we assembled a lot of QFN in the last years, but we don't have a X-ray machine by ourself, so we cant't inspect each device. This type LGA was designed on a prototyping board of our customer so we would validate our LGA reflow process and a rese
Electronics Forum | Thu Oct 08 15:15:49 EDT 2015 | huske
BGA's are by far much easier to process correctly and inspect. As for LGA's you'll never get 100% of the materiel out from under it during the cleaning process. The voiding issue is magnified with and LGA, the low standoff is the reason for the v
Electronics Forum | Wed Feb 11 08:04:16 EST 2004 | autissier
I'm looking for input from anyone who has experience assembling the LGA package on PCBs. Design, stencil opening, or other requirements are welcoming
Electronics Forum | Tue Feb 17 11:36:33 EST 2004 | POC
Try Amkor web page here http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf Regards POC
