Electronics Forum | Wed Jan 19 11:52:34 EST 2000 | Dave F
PC and Erico: Are yinns talking: 1 A component that will not lie flat on the board? 2 A component that will lie flat to the board that you can't get to solder to the pad? 3 A pad that is no longer attached to the board? 4 Something else. Whazit?
Electronics Forum | Sat Oct 02 06:26:51 EDT 2010 | patejl
Thanks for your feedback, both of you. But my problem is that we have high mix and low volume its obout 50-200 pieces. And we also have manual paste priter so the solder on the pad look always diferent. I believe that there is the problem but I cano
Electronics Forum | Thu Jan 20 02:36:29 EST 2000 | erico
Hi wolfgang,Dave & PC: What I facing are: 1. The component lie flat on the board but only one side can get solder.The pad is ok, problem is with the chip. 2.I desolder the chip and go to view it under microscope and found that there is a line near t
Electronics Forum | Fri Oct 01 17:59:13 EDT 2010 | rway
Your real problem is further upstream. The limitations of your AOI aside, first find out why your leads are being lifted. Is it through handling or are they from the reel that way? To address your AOI question, Hegemon is correct, coplanarity inspe
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Mon Apr 06 11:46:10 EDT 2009 | c111
I agree the longer soak will help provided you are not applying to much heat/time to the board now. -are the pads that lift connected to anything? This has happened to me in the past where un-connected pads would come of far easier than those connec
Electronics Forum | Fri Apr 03 15:30:10 EDT 2009 | ed_faranda
I have a VJE Summit 750 Rework machine... I don't think that matters much, but I put it out there anyway. I am removing a BGA (29mm x 29mm) off a board, but some of the pads on the board are being lifted during the process. Does someone have any
Electronics Forum | Thu Apr 09 07:37:18 EDT 2009 | fowlerchang
Another suggestion for it. Baking the whole boards before rework the BGA. It is not only benifit to the BGA but also to the pad.
Electronics Forum | Thu Apr 09 09:23:29 EDT 2009 | ed_faranda
Well, I did manage to solve this problem. I lowered the max boards temp from 245 to 235. Then I decreased my TAL. This seemed to work perfectly. Thanks everyone for your suggestions! They got me in the right direction.
Electronics Forum | Wed Apr 08 15:16:14 EDT 2009 | waveroom
I would use almost the same profile you use when putting the component down on the board. Your pre-heat is essential in rework. Also even though your machine tells you your at a specific temperature I would add a thermocouple next to the component yo
