Electronics Forum: malaysia and top and pcb (Page 2 of 3)

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll

Your opinion about RoHS and WEEE ?

Electronics Forum | Wed Jan 12 06:04:58 EST 2005 | rlackey

Hi Patrick, I see what you're all are saying, and can understand how you come to that conclusion, however I would disagree with the protectionism arguement. Most of the electronics assemblies in Europe come in from China, Taiwan, Malaysia etc, (T

Software compatibility between MSR and AX-72

Electronics Forum | Tue May 29 13:15:13 EDT 2007 | brulal1

Hi everyone you are upgrading our line, we already have and MSR HD 15 from Panasonic, we want to add and Advantis AX-72 form Universal. Panapro sotware don't have the option for the Advantis Ax72, so for now we have to used both software Panapro to g

Cleaning prototype PCB assemblies and waste water

Electronics Forum | Wed Jun 20 11:39:56 EDT 2007 | realchunks

That's like asking the IRS to do your taxes for ya. Once they're in your building, they will not leave until they go thru top to bottom. Remember, EPA Field Investigators are "supposed" to find things wrong. They may not find any thing wrong with

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin

Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or

Re: Fountain Wave Soldering and Repair/Rework Equipment

Electronics Forum | Thu Jan 21 20:22:02 EST 1999 | Earl Moon

| | Hello, | | | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, an

Need Representatives in Thailand, Malaysia, the US and China.

Electronics Forum | Mon Sep 11 20:32:19 EDT 2017 | danielgigavis

Our company is seeking partnerships to venture out to oversea markets. Need representatives/agents to promote our AOI tools to PCB makers. If you are interested please contact me at dl787@gigavis.com, my name is Daniel Lee. www.gigavis.com

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto

We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top


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