Electronics Forum: mani (Page 2 of 496)

Re: Lead free

Electronics Forum | Thu Jul 20 14:36:57 EDT 2000 | Bob Willis

Yes there will be higher process temperatures on the currently preferred alloys of tin/silver. There are not that many companies highlighting they have the solutions although many parts will be fine. If all components meet the requirements of the IP

Siemens MS-90

Electronics Forum | Fri Aug 04 08:09:41 EDT 2006 | nodlac

Hi Deni- Not having many responses is an indication that many are not familiar with this Unit. Usually, many Siemens people are on this forum. Being an applications Engineer for Siemens from 1993-1998 I did not run across many of these machines in th

Re: Crack solder joint. Whats the cause?

Electronics Forum | Wed Sep 13 12:01:26 EDT 2000 | Wolfgang Busko

Hi Charly, short question, short answer: excessive mechanical influence often in combination with bad solderjoint itself. For bad solderjoints there are many many reasons, process and material related. Are there any special circumstances that made y

Number of thermal excursions per componet

Electronics Forum | Wed Jun 27 08:30:16 EDT 2001 | Frank

I'm interested to know the guide line , or standard or evaluation methode of how many total parts per board allow to be changed and how many times a single location can be changed. Any other refinements you might have are of interest as well.

specs or guidlines for how many times you can rework a bga site

Electronics Forum | Tue Oct 15 15:00:33 EDT 2002 | Steve Walters

Is there any info, guidelines or spec's on how many time you can rework a bga location?

Squeegees for Step-Down stencil

Electronics Forum | Mon Dec 09 10:40:31 EST 2002 | MA/NY DDave

Hi I can image too many images for what your product or your process looks like. Think about hiring a consultant to come in and really look at things. YiE, MA/NY DDave

Walkmen In Assembly Area

Electronics Forum | Thu Dec 12 11:47:59 EST 2002 | MA/NY DDave

Hi Excellent. You are right that many areas due to ESD or cleanliness requirements would not be appropriate for Walkmans, personal CD players and such. YiE, MA/NY DDave

Fiducial Shapes---

Electronics Forum | Thu Dec 12 19:38:42 EST 2002 | successmani

I would like to know the reason behind using soild disks and donut shapes as the most commonly used fiducial shapes in the Industry.Why not use square shape or diamond shapes fiducial and many more instead of circular shape or solid disks. Thank you

TOMBSTONE DEFECTS

Electronics Forum | Thu Mar 20 14:01:34 EST 2003 | MA/NY DDave

Hi I understand that more circular or rounded pads also reduce the effect. I love it when many independent variables can alter the outcome. YiEng, MA/NY DDave

Wave Profile

Electronics Forum | Mon Oct 13 17:05:35 EDT 2003 | MA/NY DDave

Hi The answer is yes, These moles, as you called them, are designed more as process control test instruments than true representations of the products that you will process. By The Way, Most don't know this so I congratulate you. Many get schnoke


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