Electronics Forum: manual and screen and printing and using and mini and stencil (Page 2 of 3)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Buying stenciling and pick and place equipement.

Electronics Forum | Sun Dec 19 17:45:35 EST 1999 | Bill Petlock

Clarissa, Buying used equipment should not be risky if you do your homework. As M COX said, you should find out if the manufacturer still supports the machinery but don't take everything they tell you as gospel. Remember, they want to sell you a new

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

MPM Accuflex questions and issues

Electronics Forum | Thu Feb 15 13:46:16 EST 2018 | aemery

Griinder, Maybe it's me, but I think what you might be saying here is that you see a reflected image of the PCB or Stencil when you and teaching the fiducials and it is interfering with the teaching routine, is that correct? If this is true it is c

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach

| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr

| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 11:08:20 EDT 2000 | Fraser

Dave, Why on earth would you want to use a stepped glue stencil?. If you print slightly off contact the hight of your glue deposition will be roughly half the width of your adhesive aperture width so if you want a 10mil high deposit use a 20 mil ape


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