Electronics Forum: mechanical shock (Page 2 of 5)

Coating adhesion problems

Electronics Forum | Sat Sep 25 08:59:59 EDT 2004 | davef

IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings says: A conformal coating may have several functions depending on the type of application. The most common are: * Inhibit current leakage and short circuit due to h

Re: Solder joint quality/reliability - Mass reflow vs. handsoldering

Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon

| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B

SN100C vs. SAC 305 wave soldering

Electronics Forum | Fri Mar 31 12:27:27 EST 2006 | Marcus

We have used the SN100C for over a year now with fanastic results. We use the SAC305 for SMT and SN100C wire exclusively. There are no problem mixing the alloys. I am also on the commitee for the NASA testing. The SN100C did out perform SAC and SnPb

Silicone for bonding?

Electronics Forum | Mon Oct 06 18:41:47 EDT 2003 | davef

In addition to our earlier comments, do not be misled into thinking that silicone materials, being rubbery, will transmit shock less. Nothing is farther from the truth. Many silicone rubbers are almost totally incompressible in the short time scale.

Coating under Mil connector....

Electronics Forum | Thu Dec 22 21:29:05 EST 2005 | davef

Josh: Room Temperature Vulcanizing (RTV) is Dow Corning's trade name for it's family of silicone cure sealants. RTV is about the worst kind of coating there is. Its chemistry is highly ionic and it requires atmospheric humidity absorbed to "complete

SOIC FAIL

Electronics Forum | Tue Oct 26 13:40:47 EDT 2004 | Paul_pmd

Have the SOIC tested by independant. Clarify as to weather or not you have run this board before. Check to see if the board has been rev'ed. Sometimes IC's are rated at a clock speed or by axcess time. Engneering on this board may be at the tolorance

Re: Vibration testing of BGA packages/assemblies

Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon

| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be

Re: How long to burn in a circuit board

Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F

Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:

Re: uBGA

Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon

| Hi all , | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | 1. Is underfill required for micro-BGAs? | | 2. What type of stencil apertures are the industry standards for uB

Re: uBGA

Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh

| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st


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