Electronics Forum | Thu Mar 08 15:21:43 EST 2007 | pima
To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this pro
Electronics Forum | Tue Sep 14 10:24:53 EDT 2004 | pjc
MPM is a printing machine design and mfg company based in Franklin MA USA. Printing machines are used to deposit hi viscosity materials such as solderpaste, adhesives and silver epoxy used by the electronics assembly and semi-conductor industry. The
Electronics Forum | Wed Apr 21 17:08:32 EDT 2004 | dave
Congratulations on your new customer. This could be a keeper. Here's what you're familiar with: Electroless Nickel - per MIL-C-26074 and ASTM-B733. Electroless nickel describes the plating of nickel deposits, which may contain phosphorus and boro
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew
I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s
Electronics Forum | Thu May 06 11:37:48 EDT 2010 | davef
There is no specification. Shear tests are very material / operator dependent. BALL SHEAR TESTING OF RAW BGA DEVICES: A total of 3 devices were subjected to ball shear testing. Results of the testing indicated shear values in the range of 0.7-1.25
Electronics Forum | Tue Jun 08 06:31:33 EDT 1999 | Ross McKay
I am based in New Zealand and studying towards an MBA from Henley Management College in the UK. My current project is for a sheetmetal fabricator, on the feasibility of constructing their own in-house electroplating plant. The client specialises in
Electronics Forum | Thu Dec 12 07:37:13 EST 2002 | davef
Immersion plating appears like electroless, sorta, but is different chemically. Plating is converting metal ions in solution to metal on the board. Those metal ions are "converted" by adding electrons to them. The source of these electrons defines
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
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