Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ
Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24
Electronics Forum | Wed Feb 16 01:06:13 EST 2011 | vinitverma
Dear Gabe, Once you have the mount data in the program, you can move the camera automatically to the location by tracing each location one by one. If I remember it correctly it is done by having the location highlighted in the program and then by pr
Electronics Forum | Fri May 15 10:12:21 EDT 2015 | capse
I'm the Rep for Vitronics Soltec and ASYS EKRA in the southeastern US. I suggest you take a look at Vitronics ovens. The AutoSet feature makes new profile development as easy as possible without buying a third party accessory, The new EKRA user inter
Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq
Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!
Electronics Forum | Mon Dec 02 17:02:28 EST 2002 | Vince Whipple
Steve, I agree with the recommendation to check the temperature. This is the first place to go. Is this an IPA or water based Noclean? What is the topside temp of the assembly at the effected areas? If you are too cold you will have a tendency to hav
Electronics Forum | Fri Dec 06 18:13:15 EST 2002 | slthomas
We only have solder balling problems in the interface of the pcb with the selective soldering pallet. All other boards (single, and double sided glue and waved alike) are fine, so I'm not thinking this is going to follow the normal path for resoluti
Electronics Forum | Mon Sep 27 14:01:45 EDT 2004 | scombs
Has anyone out there had any long term experience with either of these stencil systems? I'm looking for feedback on how the foils hold up, operator interface etc. Thanks in advance. Steve
Electronics Forum | Tue Apr 23 14:18:19 EDT 2019 | griinder
Here is a Zip file containing Circuitcam 7.7, MY DATA Advanced Interfaced, and MYDATA TPSYSLive manuals. Hope this helps.
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son
.gif)
