Electronics Forum | Tue Mar 30 12:26:19 EDT 2021 | chicagoindustrial
+1 for Mid America, good company.
Electronics Forum | Tue Nov 21 00:38:16 EST 2000 | George
Hi Guys, We found the cause of the problem. It is during the import of the CAD data which on some components the Software give us the Mid X and Mid Y values. We checked from the protel and we found that some of our component coordinates do not much t
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Fri Jan 14 16:21:42 EST 2000 | Dave Chapman
We are having mid chip solder balls on chips and resistors. Seeing the problem on 80% of the assemblies we run. Anywhere from 1 to six of the balls per board. We have slowed the oven down, increased the pressure on the screenprinter to get less paste
Electronics Forum | Fri Jan 21 10:40:15 EST 2000 | Dave Chapman
Having adjusted the profile speed slower and adjusting the temps to the recommended lower levels, amazingly the mid chips have almost disapeared (90%). It appears they have been trying to run a "1 profile fits all" on the ovens for Alpha 737 and UP78
Electronics Forum | Thu Apr 12 00:25:25 EDT 2007 | raychamp007
Thanks davef! We found some SOIC & QFP with all leads having toe down problem. The heel fillet unable extend to the mid point outside bend. Do you have solutions for the problem? I have a question: How about the normal gull wing lead which is flat &
Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f
Electronics Forum | Thu Jul 17 15:12:18 EDT 2008 | slthomas
To quote a regular here, "Are you sure your washer is set up correctly?" :P He's a WS junkie. This is a really common problem and is discussed here often. Mid chip solder balls (solder beads) are almost always the result of too much paste being dep
Electronics Forum | Tue Mar 02 16:49:37 EST 2010 | davef
For a earlier, similar thread posted by an old friend Cal Driscoll ... Classes of BGA inspection machines * GO/No-go Machine specs: 50Kv, limited zoom, perpendicular head, board size. * Low to mid range machine:+75Kv, Angular inspection,zoom,image c
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
