Electronics Forum: mid-chip solder balling (Page 2 of 214)

Re: solder balling

Electronics Forum | Thu Aug 10 03:30:42 EDT 2000 | JohnW

Ramon, Solder ball' are a bitch aint they?, identifying the right location to fix em is a bigger one. As you and the rest of teh guy's have said yes you'll need to look at your stenil..but maybe your stencil is good so you'll need to look else where

Re: solder balling

Electronics Forum | Mon Aug 07 16:23:34 EDT 2000 | Ramon I Garcia C

Hi!!! Thanks frieds for your advising, I have a MPM UP2000, I'm going to chek the humidity control, too I'll chek the profiles again, this plant it's located close to the beach about 1/2 mile from. However if you know some table to calculate t

Re: Micro solder balling

Electronics Forum | Thu Oct 26 12:40:49 EDT 2000 | NLykus

Antonio, I would need to have more profile information i.e. preheat temp (hold time) as well as soaking zone (time). What is the peak temperature and how long is it held there. Also, one more thing to check, because I have seen it in the past, is

Re: Micro solder balling

Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss

Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone

mask finish and solder balling

Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy

We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be

Solder balling under passives

Electronics Forum | Mon Sep 19 09:31:28 EDT 2016 | emeto

Whatever the cause is, will be fixed by applying less paste. So Homeplate it is.

Solder balling under passives

Electronics Forum | Mon Sep 19 21:35:54 EDT 2016 | shriram

Appreciate your suggestion. NSMD pads are used for this design, the anomalies we found are 1. the trace running between pads has a lesser solder mask height compared the other area of the pads. 2. the NSMD pads doesnot have a trench close to pad e

Re: Re balling BGA

Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach

| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833

Re: Re balling BGA

Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon

| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P

Re: Re balling BGA

Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach

| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |


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