Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95
Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Wed May 24 16:47:21 EDT 2006 | patrickbruneel
Inds, It's about time that lead-free components can stand higher temps "myth" stops. The only difference is the plating, the component itself has not changed. Can you give us an update on this threat? If you�re the same inds http://www.smtnet.com//
Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds
John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
Electronics Forum | Tue Jan 04 13:01:25 EST 2005 | Brad
I have two questions that maybe someone can answer? 1. Can or should lead free components be used with standard 63/37 processes? including sn/pb pcb's? 2. Can or should sn/pb components be used for lead free process? I have recieved mixed feeling
Electronics Forum | Mon Dec 05 15:42:37 EST 2005 | les
Anyone with definitive reliability data on mixing thru hole lead free terminations (SAC and Sn/Cu) with Sn/Pb solder. Seems like a lot of conflicting information
Electronics Forum | Fri Jan 30 18:24:09 EST 2009 | gsala
Buenas dias Jos�, It shoul not be a problem. We had situation like that when in the early 2006 the Lead Free fase in Pb fase out, no pbm on solder joints. Today, after about 3 years, those cards are stil working in the field without any defect. Reg
Electronics Forum | Thu Oct 30 21:55:27 EST 2003 | johnwnz
Now I've checked the archives on this and found the starts of an answer but not much else, but then that posting was a while ago and I though there would be some more data now. So here's the question: who, if anyone is placeign Pb-free BGA's (ideally
Electronics Forum | Fri Jan 30 15:11:50 EST 2009 | joseluis_amper
Dear Sir. Recently we had a problem in our production. We had pcbs with no RoHs (with solder Pb in pads) but we used paste Lead Free. I want to know if we will have problems in this solders in the future, because (perhaps)the solder will be broken, o
