Electronics Forum: mount devices (Page 2 of 24)

Gold Leaded SMT devices

Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef

The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu

Re: X-Ray for CSP devices

Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon

Hello All, I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? Also anyone who is mou

Re: X-Ray for CSP devices

Electronics Forum | Fri Jul 16 10:32:52 EDT 1999 | Upinder Singh

Hello All, I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? Also anyone who is mou

Re: X-Ray for CSP devices

Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani

Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f

Re: Classification of moisture sensitive devices

Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F

Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. Going through datasheets wasn�t that helpfull, so does anyone know of a source for that

Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 07:15:49 EDT 1999 | SC

I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capabl

Re: Classification of moisture sensitive devices

Electronics Forum | Thu Aug 26 10:21:22 EDT 1999 | John Thorup

Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. Going through datasheets wasn�t that helpfull, so does anyone know of a source for

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 07:28:03 EDT 1999 | Earl Moon

I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.

I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: Classification of moisture sensitive devices

Electronics Forum | Thu Aug 26 10:49:36 EDT 1999 | Wolfgang Busko

Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. Going through datasheets wasn�t that helpfull, so does anyone know of a source


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