Electronics Forum | Fri Apr 17 14:37:13 EDT 1998 | Justin Medernach
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, Try
Electronics Forum | Thu Aug 13 00:18:28 EDT 2015 | Banana
hi, currently we have Fuji CP8 and XP242 machine for pick and place. as now, most of the customers are going for the 0201 components, so i would like to know does the CP8 has the capability to mount 0201. because, i had run 1 model that has 0201 part
Electronics Forum | Fri Feb 05 04:18:44 EST 1999 | Joni Siipola
| Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via holes to the
Electronics Forum | Tue Nov 11 07:52:26 EST 2008 | jdengler
Is the part height set correctly. Too high and it gets ped. Too low and it's jammed into the board. Both can cause poor placement. Jerry
Electronics Forum | Tue Nov 11 09:45:44 EST 2008 | slthomas
Is the package too large for the nozzle? They can rotate (or just fly off) after centering if they're not stuck solidly to the nozzle when they're being rotated for orientation.
Electronics Forum | Mon Mar 21 12:36:22 EDT 2011 | scottp
I would run the passive side first just because the BGA is probably moisture sensitive and I wouldn't want to have to keep track of the time between first and second reflow.
Electronics Forum | Mon Mar 21 12:43:20 EDT 2011 | hegemon
Passives first reflow, and BGAs second side reflow. Uses only one heating cycle for your BGAs, and the passives will stay in place just fine given correct profile parameters. There are a few exceptions, but this is generally how it is done. My $.02
Electronics Forum | Thu Aug 20 15:00:35 EDT 2015 | scotceltic
A few other items that will help. Make sure your PCB has good support inside the CP8 and always make sure your paste registration is dead nuts.
Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
