Electronics Forum | Tue Jan 12 15:29:40 EST 2010 | davef
What is your concern regarding voiding in QFN solder connections?
Electronics Forum | Tue Nov 28 07:55:58 EST 2006 | davef
Too much solder paste is NOT in our "Top Ten Causes of Tombstoning". Try: * Searching the fine SMTnet Archives for background * Looking here: http://www.efdsolder.com/PDF/EFD-Tombstone-Troubleshooting.pdf We have no relationship, nor receive benef
Electronics Forum | Tue Jul 01 12:21:16 EDT 2008 | short_timer
Let�s say I want to increase the shear strength of a solder joint. Does a lot of solder around a joint create more strength? Why not just absolutely bury the component lead in solder. My initial thought is that it doesn�t increase strength, but I don
Electronics Forum | Tue Jul 01 13:45:12 EDT 2008 | realchunks
The actual solder joint occurs BETWEEN the part and the pad. Adding more solder on top will add strength slightly, just by being in the way when you pull on it sideways. A weak joint with a weeks worth of solder on it will still be weak. Solder is
Electronics Forum | Mon Dec 07 14:55:41 EST 2015 | clydestrum
So I have an issue coming up that I'm not too sure how to handle. A board was designed with the wrong footprint for a 3-lead transistor in which the single-lead side has a much larger (think thermal pad for qfn) copper land than what is meant for the
Electronics Forum | Tue Dec 08 15:19:42 EST 2015 | proceng1
Apply the correct amount of paste for the pad size should work ok, as long as the part starts out in the paste. If you have a reduced aperture and the leg doesn't quite touch any paste could result in non-wetting or insufficient solder issues. I gu
Electronics Forum | Mon Oct 16 16:30:16 EDT 2006 | Cmiller
PS, we had a similar situation when a quick disconnect on the flux supply went bad, limiting flow. Take the nozzle off and turn the fluxer on, you should get a lot of flux flow, If not, the lines are probably clogged.
Electronics Forum | Mon Oct 16 16:45:52 EDT 2006 | russ
May need to change nozzles for this waterbased flux. Seems quite high to me as well Russ
Electronics Forum | Wed Nov 29 01:05:48 EST 2006 | callckq
Dear Davef, Bill West, Thanks for your valuable inputs..Have a nice day.
Electronics Forum | Sun Dec 17 23:22:17 EST 2006 | bigdaddysoy9
If you are talking about a chip capacitor, then I think it's 50% (of component width) side to side for class 1 and 2. And 25% for class 3. There is no end overhang permitted for all 3 classes.
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