Electronics Forum: n2 and h and solder (Page 2 of 3)

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ

Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Wed Jul 31 13:09:17 EDT 2002 | gdstanton

Anyone have experience with Indium NC-SMQ92J solder paste used in an inert (N2) reflow oven?

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef

First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Fri Aug 02 12:01:40 EDT 2002 | johnw

interesting, not at all what we were told so yes lot's of contradictions comming from them, I have to say personally I've not beein impressed with there technical service of late, are they getting complacent I ask? it's strange they say it'll cause

Manual soldering - solder wire diameter and soldering iron tip size for different component sizes

Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais

We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Thu Aug 01 13:04:57 EDT 2002 | gdstanton

Its interesting. It appears I'm getting conflicting feeback from Indium. This says its not a problem... http://indium.custhelp.com/cgi-bin/indium.cfg/php/enduser/std_adp.php?p_sid=kTDKGClg&p_lva=&p_faqid=355&p_created=1014734692&p_sp=cF9ncmlkc29

SMT Solder paste and wave flux evaluation

Electronics Forum | Tue Feb 01 09:53:37 EST 2005 | Howard Sommerfeld

I also have a spreadsheet tool for comparative analysis using criterion weighted scoring. It can be used to analyze any decision, and helps groups reach consensus on why a particular alternative is the way to go. As final steps you can also consider


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