Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse
Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co
Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon
| Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf | I
Electronics Forum | Thu May 08 12:11:30 EDT 2008 | boardhouse
Hi Wayne, I am just curious what material is being called out. Are you just specing FR4 or are you calling out a particular IPC 4101 / Some recommended laminates designed for Lead free assembly are: Isola 370HR Nelco 4000-11 or 4000-29 Iteq IT15
Electronics Forum | Thu Jan 31 18:14:40 EST 2008 | boardhouse
Hi Felix, First thing to verify is that your supplier is actually suppling you with the correct material. China is known for not keeping with the requested materials and will substitute if not controlled. I would recomend ITEQ, TUC or Nan ya for of
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
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