Electronics Forum: nipd and finish and lead and paste (Page 2 of 3)

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef

EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Thu Nov 15 09:29:29 EST 2012 | anvil1021

Maybe this piece of information will help. In China (just returned from visit) there are many factories that are using a dual temperature process using SAC305 or Sn100C and 42/58. Apparently this allows them to run their through hole parts through re

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef

Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Sat Nov 03 10:57:27 EDT 2012 | davef

EricR: Regarding "*** By the way, since we have used the Tin-Silver-Copper lead free solder there has been a strange liquid type chemical leek from the oven exhausted pipes." ... I don't know anything about your process, but the first thing I'd inve

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek

Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit

0201 and Lead Free

Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef

A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one

Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one

Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re

SN100C alloy positive and negatives

Electronics Forum | Wed Dec 24 15:28:17 EST 2008 | edmentzer

We use SN100C for wave soldering and hand Lead free soldering and have had very good results. The wire cored solder for hand soldering flows good and makes very good solder joints. The SN100C in the wave solder machine also works very good. We use

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef

People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t


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