Electronics Forum | Wed Sep 22 15:33:54 EDT 2010 | davef
Comments are: * First, no one is looking at your posting. You need to post in the 'SMTnet Production Forum' [top of the page]. This 'SMTnet Site Support Forum' is for whiners that want to complain to Neil about problems in logging-in, font that's to
Electronics Forum | Wed Mar 14 10:42:20 EDT 2018 | jon_roberts
Dave, thanks. I was going to change Cu/PD/Au to Ni/Pd/Au and then my question is: Has anyone had soldering issue with components (ICs) with the above finish during reflow and/or had to change the oven profile to improve the wetting. Sorry for confusi
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Mon Jul 07 11:46:29 EDT 2008 | aj
Hi All, Can anyone advise the spec for land size of a lead 0.2mm in width? I am placing a TQFP128 0.4mm pitch, the leads seem to be wider than the actual pads they are been placed on? I am also experiencing poor wetting on this part , it has NiPdAU
Electronics Forum | Fri Sep 19 21:31:15 EDT 2008 | trynders
Thanks for the response guys! The parts are being sent to a local lab as we speak. I'll let you know the results when I get them. I am not sure the purpose of the copper band, but the black around the band is just shadowing from how I took the pi