Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Thu Jun 14 13:41:06 EDT 2001 | bentzen
Thanks a lot Dave. I think I will stay away from OSP. I just thought that it could be a cheaper solution than NiAU for fine pitch. And I don�t trust the silver coating types. Brian
Electronics Forum | Fri Jul 16 22:44:27 EDT 1999 | Vic Lau
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
Electronics Forum | Tue Apr 22 14:53:22 EDT 2003 | Robert
OK...I'm hooked on this subject. Were changing from NiAu to OSP as a "savings" and not because we choose too. So far we have had great success with BGA and are working on TSOP, SOP, etc. The only thing we have come to dislike so far is the ring aroun
Electronics Forum | Thu Apr 22 07:51:32 EDT 1999 | Vic Lau
after soldering transistors on a flex circuit (Ni/Au plated), one of the lead lift-up from the pad. under microscope (1,000 X), i find some cracks on the the pad surface. with edx analysis, the surface is mainly nickel. have you ever encounter suc
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Wed Dec 13 10:24:52 EST 2000 | Wolfgang Busko
Hi Jack, I once tried this finish ( without changing any process parameters ) and encountered wetting problems even in the first reflow process. It was thought as cheaper alternative to Ni/Au we use for planarity reasons. Heard of the same problems
Electronics Forum | Tue Dec 13 22:58:43 EST 2005 | Mike Kennedy
Dave, I have read an article by Vern Solberg who said that Electro plating Ni/Au in not recommended for PCB's. I have tried his email but get bounce back. Do you know him or his email? I knows its a long shot to ask you, but it never hurts to ask...
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