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How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

SMTA International Tackles Head-in-Pillow Defects

Industry News | 2011-08-17 12:59:10.0

The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

New IPC Initiative Focuses on E-mobility Quality & Reliability

Industry News | 2022-05-27 14:34:04.0

From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.

Association Connecting Electronics Industries (IPC)

3D SPI manufacturer

3D SPI manufacturer

Videos

Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the

CNSMT CO.LTD

SMTA Intermountain Chapter to Hold Annual Technical Symposium

Industry News | 2013-09-10 12:18:26.0

The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Surface Mount Technology Association (SMTA)

I.C.T SMT Vacuum Reflow Oven Machine

Industry News | 2022-10-13 07:44:15.0

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates

Dongguan Intercontinental Technology Co., Ltd.

IPC’s Annual High Reliability Forum Adds Microvia Summit to Conference Lineup Event to discuss solutions to microvia challenges and reliability concerns for Class 3 electronics

Industry News | 2019-03-25 19:02:23.0

IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.

Association Connecting Electronics Industries (IPC)

SH8080 3D SPI Solder paste inspection system supplier

SH8080 3D SPI Solder paste inspection system supplier

New Equipment | Test Equipment

Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the

CNSMT CO.LTD

Double Track Solder Paste Inspection Machine

Double Track Solder Paste Inspection Machine

New Equipment | Test Equipment

Inline Dual Track 3D SPI, Double track solder paste inspection mail:sales@smtlinemachine.com whatapp/wechat:+8615915451009 Specification: 技术平台/Technology Platform Dual conveyor Type-B/C 适用系列/Series S serials  型号M

CNSMT CO.LTD

Nordson ASYMTEK's Programmable Tilt + Rotate Uses 5 Axes for Fluid Dispensing

Industry News | 2015-07-08 14:20:26.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.

ASYMTEK Products | Nordson Electronics Solutions


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