Electronics Forum | Tue Oct 03 22:48:21 EDT 2006 | C.K. the Flip
It sounds as if this Sn100c HASL process is still in its infancy requiring further process development and characterization..weather its a better more active flux or a different profile... Given your situation of the Sn100c coating actually "repellin
Electronics Forum | Mon Dec 03 20:30:58 EST 2007 | shy
Q: I thought you said that the parts that weren't wetting in reflow were the parts with epoxy. A: Yes you're correct. Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in ref
Electronics Forum | Wed Jul 07 11:02:07 EDT 2010 | davef
Rob gave you very good analysis and suggestions for troubleshooting your non-wetting issue. We agree with his sequence of troubleshooting. The following comments are meant to be a line to supplement Rob's plan of attack. This adds to Rob's comment
Electronics Forum | Thu Feb 27 16:23:37 EST 2020 | dwl
http://www.circuitnet.com/news/uploads/3/Comparing-Soldering-Results-of-ENIG-and-EPIG-Post-Steam-Exposure.pdf Years ago, I battled this problem. ENIG PCBs reflowed with active WS flux. We built one side, and then washed them because they were going
Electronics Forum | Tue Dec 08 15:19:42 EST 2015 | proceng1
Apply the correct amount of paste for the pad size should work ok, as long as the part starts out in the paste. If you have a reduced aperture and the leg doesn't quite touch any paste could result in non-wetting or insufficient solder issues. I gu
Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny
Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Tue Jul 26 23:02:22 EDT 2005 | crishan
Hello, We currently have huge quality issues with our Inertec selective solder machine, the model we have does not pump solder, rather the solder bath is raised to the product. We have continuing issues with bridging and non wetting of joints. We a
Electronics Forum | Tue Sep 14 00:22:08 EDT 2010 | sachu_70
Hi Gani, non-wettting issues can surely be resolved. At first, would appreciate if the following info could be shared. Do you supply just one PCBA product to this client or is the complaint towards one of the many products that you deliver? Also, doe
Electronics Forum | Mon Nov 30 14:29:46 EST 2020 | kylehunter
Hi all. A recent board has shown some issues with graping and non-wetting on some 0402 capacitors. I believe we have the issue sorted. A combination of a 4 mil stencil with 2 mil reduction not giving us enough paste, and too long of a soak profile.
