Electronics Forum: nondestructive (Page 2 of 4)

Component failure analysis

Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg

Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would

SWITCHING OF WAVE SOLDER MACHINE FROM LEADED TO NO-LEAD

Electronics Forum | Fri Aug 12 14:11:20 EDT 2005 | pete_d

Bob, I've heard that many WSM manufacturers are not providing warranties for stainless steel solder pots that are holding SN100 because they are not completely confident that the SN100C alloy is non-destructive to the pot. fct�s own webpage states

Black Pad

Electronics Forum | Tue Jan 10 11:51:16 EST 2006 | jax

I don't believe I have ever seen a non-destructive test for "Black Pad" that I could take back to a Fab house and collect monetary losses with... But if this test method actually does hold merit then collect away. I would like to know how this metho

Conformal Coat Thickness

Electronics Forum | Mon Jul 23 17:49:04 EDT 2007 | davef

We know nothing of DeFelsko, but do understand how they distinguish between the solder mask and the conformal coat. DeFelsko manufactures hand-held, non-destructive coating thickness gages that are ideal for measuring the dry film thickness of confo

Re: Solder paste SPC analysis

Electronics Forum | Wed Oct 25 17:26:38 EDT 2000 | Dave F

George: Crucifixions!!! YES!!! I love crucifixions!!!! [Well I do, providing I�m not the crucifixee that is ] The pomp, ceremony, wailing, grumbling, and brat on the grill. You�ll find little sympathy here. Phil and Wolfgang make good points.

A Note from KIC Thermal

Electronics Forum | Mon Aug 21 18:13:19 EDT 2000 | Greg Jones

In Steve's last posting he wrote (in part): "I've decided that if KIC can recommend that profiling be done on unpopulated boards (how valuble is THAT??)" I contacted Steve off forum to discuss this. In the paper referenced by John Thorup (above),

Voids in solder fillet

Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire

Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r

Component failure analysis

Electronics Forum | Tue Aug 23 13:25:10 EDT 2005 | MMurison

MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing, e.g. visual, x-ray, C-SAM, el

Blowholes during wave soldering

Electronics Forum | Mon Sep 03 09:48:12 EDT 2007 | davef

Joris We don�t know the maximum period to store the boards without having problems with blowholes. Too many variables to determine. We prefer to just fix the problem, but understand that you have stock that you need to build-down. Determining mois

Vapour phase soldering - problem

Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad

One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,


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