Electronics Forum | Sat Jan 06 11:39:56 EST 2001 | Steve Thomas
On a related note, I'm wondering if any of the newer devices have any way to factor in paste not releasing from the corners, or for that matter, radiused, oval, or round apertures. We have an LSMII, and all it does it let you draw a rectangle around
Electronics Forum | Sat Sep 30 12:14:32 EDT 2000 | jarnopy
Hi Maybe you have too small apertures in stencil. Good apertures size is 90% from pad. And one thing what you can try is that you cut your stencils(blades) aperture corners round (i mean like a oval). I hope that these advices can help you.
Electronics Forum | Thu Sep 21 20:41:19 EDT 2000 | Dave F
Many moons ago, at another company, we bolted an oval "carousel" to the ceiling. In our case, the carousel was use to convey wave soldering pallets from the end of a in-line washer to the from-end of the wave soldering machine. The pallets hung fro
Electronics Forum | Wed Jan 13 17:08:20 EST 1999 | Jim Nunns
I have some BGAs with a warped chip carrier. Some of the balls are tall like columns and some are short oval shapes. How can I determine when warpage will cuase failures from stress. Is there a spec out there from studies anyone has done? Any commen
Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
Electronics Forum | Tue Aug 17 12:27:48 EDT 2010 | namruht
That reminds me...We already have home plate apertures on our stencil. Try number 2...I tried an overall reduction based on the copper layer of 10% and used oval apertures. I hope that you guys can suggest something that I am over looking. I know tha
Electronics Forum | Wed Jun 12 17:05:41 EDT 2013 | danselness
DeanM - thank you for your response. I will work on uploading a picture of the bridges. We are focusing our efforts on nine boards that use the TO-220 package. I will also pass along your idea of Oval Pads to our Manufacturing and Design Engineers
Electronics Forum | Thu Nov 02 09:45:00 EST 2000 | bierleinb
I would check trace-pad interactions as you may be robbing heat from one of the pads causing uneven heating during reflow. Also, measure paste deposits on trouble parts to see volume depsoted across the pads. You should easily be able to do 0402s w
Electronics Forum | Wed Oct 25 13:42:32 EDT 2000 | Chris McDonald
I was wondering IF anybody has has success wave soldering a 50 (2 rows of 25) pin 0.050" pitch thru-hole connector. I seem to be getting alot of bridging no matter what I do. Is there a design spec for the size and shape of pads? The pads on the pcb
Electronics Forum | Wed Jan 13 19:13:59 EST 1999 | Michael Allen
Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype" line at our component supplier's lab (non-production overmold material was used). Production parts have not exhibite
.gif)
