Electronics Forum | Tue Dec 04 18:38:28 EST 2007 | stevek
With two rows, you can overprint to the outside to make up the solder volume. It's when you have rows in the middle that things get tough. A good stencil house should already have overprint libraries for this.
Electronics Forum | Fri Jun 10 19:05:23 EDT 2022 | llawrence
Overprint, that is putting extra solder on with the stencil that is even further out from the pads, with the idea that it will suck that solder up during reflow? I could give that a try. Are there any general recommendations when overprinting? And wh
Electronics Forum | Mon Mar 13 06:57:24 EST 2006 | aj
35% and overprint by 3thou on the leads.
Electronics Forum | Mon Mar 13 06:58:05 EST 2006 | aj
overprint by 3 thou on the length of leads only
Electronics Forum | Mon Mar 13 09:14:18 EST 2006 | russ
Thanks A.J. knew about the thermal pad reduction but not the overprint. off to CAD!
Electronics Forum | Mon Dec 18 03:06:31 EST 2006 | aj
Darby, You mentioned that you have not incorporated the recommended overprint ? is this so. aj...
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Wed Aug 22 17:29:29 EDT 2001 | Michael
We've found beading is not neccesarily the amount of paste but where it's applied. Trapping paste under components seems to be the culprit. On components where we couldn't reduce aperature size we simply moved it outward actually overprinting the p
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