Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad
I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package
Electronics Forum | Tue Jul 25 14:30:04 EDT 2017 | emeto
Looks like you have a great wetting of your paste :). Once body has been in contact with molten solder, the package could suffer damages on the body(outside and inside) and on the circuitry inside. It is considered a defect. I have seen that before a
Electronics Forum | Tue Apr 07 14:56:30 EDT 2015 | davef
Try a beer can opener, like thi: http://www.foodservicewarehouse.com/american-metalcraft/cab45/p386302.aspx?utm_medium=cpc&utm_term=American-Metalcraft-CAB45&utm_campaign=Bottle-Openers&utm_source=googlepla&source=googleps&utm_content=googlepla|mkwid
Electronics Forum | Fri Jan 26 09:37:42 EST 2001 | blnorman
Our current solder paste vendor wants us to evaluate a paste. One of the selling points is that this paste (SnPb) will have the same flux package that will be used with some of their lead-free pastes. We are looking at going to SAC when we go lead-
Electronics Forum | Thu Jan 03 19:26:04 EST 2002 | ianccy
Thanks guys, it's very helpful.
Electronics Forum | Thu Jan 03 06:58:41 EST 2002 | Scott Davies
MSL is "Moisture Sensitivity Level", and you should be able to find information on the websites of individual component manufacturers. For example, take a look at Infineon; http://www.infineon.com/greenproduct/msl_classification1.htm
Electronics Forum | Thu Jan 03 14:12:45 EST 2002 | davef
I know fmonette has a MSD audit check list. Maybe when he posts, he'll give us a MSD control procedure aimed at operations types.
Electronics Forum | Mon Apr 05 21:46:12 EDT 2010 | isd_jwendell
I have been using this series with AIM SnPb no-clean paste without problems.
Electronics Forum | Mon Apr 05 22:52:40 EDT 2010 | davef
Sounds like you're not getting the solder connection hot enough. Talk about: * Temperature of the solder on the connection * Solder alloy * Board solderability protection * Component solderability protection
Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
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