Electronics Forum | Fri Mar 06 10:32:34 EST 2009 | fountain42
Yes, We've already experienced this same problem. 1) What kind of flux are you using? No Clean? Rosin? OA? 2) If it's OA, What kind of water wash do you do? Do you use DI water? How Hot? Who's machine? What are the pressures? 3) Have you performed a
Electronics Forum | Wed Mar 04 11:16:25 EST 2009 | patrickbruneel
From your description of the problem first reduced SIR to dead short is exactly what happens with dendrite growth. What is needed to form them is low bias voltage (10 volt range is ideal with low current), a surface, 2 conductors (containing tin), io
Electronics Forum | Mon Jul 10 09:28:20 EDT 2000 | George English
I am looking to purchase an inexpensive gerber editing package. Does anyone have any ideas. It will be primarily used for the design of solder paste and adhesive stencils.
Electronics Forum | Thu Jun 05 00:00:09 EDT 2003 | Jacky
Hi, Can anyone tell me where I can get heatsinks for DPAK devices? It will be used for cooling IGBTs. Preferably, the heatsink device should be soldered for easy production. Thanks alot.
Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik
Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads
Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik
Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads
Electronics Forum | Mon Apr 05 22:52:40 EDT 2010 | davef
Sounds like you're not getting the solder connection hot enough. Talk about: * Temperature of the solder on the connection * Solder alloy * Board solderability protection * Component solderability protection
Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist
We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X
Electronics Forum | Mon Apr 05 21:46:12 EDT 2010 | isd_jwendell
I have been using this series with AIM SnPb no-clean paste without problems.
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
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