Industry News: packing (Page 2 of 38)

Amphenol Borisch, REI, Gen Pack Assembly And Others Selling Excess Assets

Industry News | 2014-06-23 12:26:06.0

EMS providers Amphenol Borisch, REI, Gen Pack Assembly and others will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for the auction will open promptly at 8:00am EST on June 23, 2014 and the closing will begin at 1pm EST on June 24, 2014.

Baja Bid

Bajabid.com Is Set To Complete Their Latest Sealed Bid Auction.

Industry News | 2014-02-26 16:10:37.0

Bajabid.com is set to complete their latest sealed bid auction. The equipment is located at the Gen Pack Assembly facility in Stoney Creek; Ontario, Canada.

Baja Bid

Baja Bid Announces a Sealed Bid Auction

Industry News | 2014-02-11 20:08:07.0

Bajabid.com, a leading asset management and auction company in the electronics manufacturing and assembly industry is set to conduct a sealed bid auction.

Baja Bid

SMT mounter Feeder common types and classification from KINGSUN

Industry News | 2023-08-17 14:26:37.0

Today, KINGSUN shares with you the common types and classifications of SMT mounters.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

New IPC-1758 Data Exchange Standard on Pack and Packing Materials Provides Consistency, Efficiency and Integrity to Declaration Process

Industry News | 2012-07-12 16:39:49.0

— IPC — Association Connecting Electronics Industries® has released IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials.

Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

Clariant introduces pioneering Humitector™ Type 2 Non-Reversible Humidity Indicator Cards for SMD Dry Packing at Semicon Taiwan

Industry News | 2018-08-21 14:28:35.0

Clariant's new Humitector Type 2 Non-Reversible Humidity Indicator Cards contain a patent-pending non-reversible 60% humidity spot indicator which enables them to indicate whether dry packed surface mount devices (SMDs) have been exposed to high levels of moisture at any point during shipment or storage. This unique innovation offers a major step forward in preventing moisture-compromised surface mounts from entering production.

Clariant Cargo & Device Protection

Meet Clariant at IPC APEX EXPO for a one-to-one interview about the unique support for more sustainable electronics’ production and the J-STD-033D-preferred unique moisture-control combo for dry packe

Industry News | 2020-01-13 16:38:18.0

As electronics brands demand more sustainable materials and product reliability across their supply chains, Clariant brings two elements together to uniquely boost moisture-exposure assurance for dry-packed Level 2+ components. It is the only option for semiconductor manufacturers, integrated circuit companies and OEM suppliers to meet latest J-STD-033D preferences and increasing low-halogen & cobalt-dichloride-free specifications.

Clariant Cargo & Device Protection

CLARIANT INTRODUCES HUMITECTOR™ TYPE 2 NON-REVERSIBLE HUMIDITY INDICATOR CARDS FOR SMD DRY PACKING

Industry News | 2018-06-13 12:52:51.0

Market's first non-reversible humidity indicator Card Type 2 is low-halogen and cobalt-dichloride-free. Complies with the latest revision of IPC/JEDEC standard, J-STD-033D.

Clariant Cargo & Device Protection

Nordson DAGE Selected to Join a UK Consortium to Develop Test & Inspection Technologies for High-Volume Battery Manufacturing

Industry News | 2019-09-18 16:29:29.0

Nordson DAGE is delighted to announce its success in joining a group of leading UK companies, including Williams Manufacturing Group and Unipart, to advance the UK’s low-carbon automotive capabilities. As part of the UK government’s Industrial Strategy, five projects totaling £33M were awarded through the Advanced Propulsion Centre (APC).

ASYMTEK Products | Nordson Electronics Solutions


packing searches for Companies, Equipment, Machines, Suppliers & Information

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