Electronics Forum | Fri Apr 17 22:07:53 EDT 1998 | D.Lange
| We are having some problems with "drawbridging" on 0805 film capacitors. | We have already reduced the pad width from .050" to .040" based on input | from vendor. Defects appear to be random as far as location on the PWB and direction | of placem
Electronics Forum | Thu Sep 06 10:58:49 EDT 2001 | davef
If your words imaged correctly, it seems a bit strange to have a trace that is wider than the pad where it connects, because we�re used to seeing a narrower trace connecting to a wider pad. It�s tough to determine what the designer was thinking abou
Electronics Forum | Tue Nov 09 16:24:53 EST 2004 | davef
Your board fabricator is: * Correct that +-20% is the tolerance of the IPC specification * A moroon for not correcting the artwork to compensate for etch factors Find a new supplier. Baring that, if the SMT pad width is critical, you can specify th
Electronics Forum | Tue Jan 16 09:23:26 EST 2001 | P.Gerits
Hello, Standard way to calculate stencil design can be done as follows: A normal ratio of aperture width/stencil thickness = 1.5 for pitches below 650u A normal ratio of stencil aperture width against pad width = 0.8-0.9 (or stencil aperture 10%-20
Electronics Forum | Wed Mar 29 22:30:13 EST 2000 | cklau
Hi guys; There are a few points that should be taken in to considerations regarding IPC-SM-782 land pattern and design rules. As a general rule all SMT reflow pattern should be in comply with SM-782 but however for special cases like : * PLCC land
Electronics Forum | Thu Aug 08 13:05:45 EDT 2019 | horchak
What is your pad width? What is lead width? Is the part gang masked, or has masking between the pads? Pads plated or HASL, if HASL how thick? What is board thickness and size? Does it need to be fixtured for support thru out the process. Semi auto sc
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Tue Aug 23 16:58:34 EDT 2011 | asksmt
Hi, Any one known if it is really benificial to enlarge the end pads width of SSOP package ? does this really solve any cold solder issue ? facing some cold solder issues on one design only ! Please suggest ! Thanks alot in advanced..!
Electronics Forum | Mon Sep 18 01:47:18 EDT 2017 | bukas
I would go with wire thickness + 0.4 to 0.8 mm for pad width, and pre-tinned lenght + 0.5mm what seems to me like problem is that it can easily roll off the pads in reflow oven
